2022 ICCAD CAD Contest Problem B-Reference-Cited by-同舟云学术

2022 ICCAD CAD Contest Problem B

Published:2022-10-30 Issue: Volume: Page:
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Container-title:Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design
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Author:

Hu Kai-Shun¹,Lin I-Jye¹,Huang Yu-Hui¹,Chi Hao-Yu¹,Wu Yi-Hsuan¹,Shen Chin-Fang Cindy¹

Affiliation:

1. Synopsys, Inc., Taipei, Taiwan

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3508352.3561108

Reference5 articles.

1. T. Thorolfsson , G. Luo , J. Cong and P. D. Franzon , " Logic-on-logic 3D integration and placement," 2010 IEEE International 3D Systems Integration Conference (3DIC) , 2010 , pp. 1 -- 4 T. Thorolfsson, G. Luo, J. Cong and P. D. Franzon, "Logic-on-logic 3D integration and placement," 2010 IEEE International 3D Systems Integration Conference (3DIC), 2010, pp. 1--4

2. J. Kim GDS Design Tools for Monolithic 3 D I Cs ," 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD) , 2020 , pp. 1 -- 8 . J. Kim et al., "RTL-to-GDS Design Tools for Monolithic 3D ICs," 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 2020, pp. 1--8.

3. S. S. Kiran Pentapati , K. Chang , V. Gerousis , R. Sengupta and S. K. Lim , " Pin-3D: A Physical Synthesis and Post-Layout Optimization Flow for Heterogeneous Monolithic 3D ICs," 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD) , 2020 , pp. 1 -- 9 . S. S. Kiran Pentapati, K. Chang, V. Gerousis, R. Sengupta and S. K. Lim, "Pin-3D: A Physical Synthesis and Post-Layout Optimization Flow for Heterogeneous Monolithic 3D ICs," 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 2020, pp. 1--9.

4. Compact-2D: A Physical Design Methodology to Build Two-Tier Gate-Level 3-D ICs

5. 2022 ICCAD CAD Contest Problem B: http://iccad-contest.org/Problems.html 2022 ICCAD CAD Contest Problem B: http://iccad-contest.org/Problems.html

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