iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement-Reference-Cited by-同舟云学术

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iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement

Published:2023-10-28 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)
language:
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Author:

Zhao Xueyan¹,Chen Shijian¹,Qiu Yihang²,Li Jiangkao³,Huang Zhipeng⁴,Xie Biwei¹,Li Xingquan³,Bao Yungang¹

Affiliation:

1. Institute of Computing Technology, CAS,State Key Laboratory of Processors,Beijing,China

2. School of Integrated Circuits, Guangdong University of Technology,Guangzhou,China

3. School of Mathematics and Statistics, Minnan Normal University,Zhangzhou,China

4. Peng Cheng Laboratory,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10323590/10323543/10323811.pdf?arnumber=10323811

Reference19 articles.

1. An efficient and effective detailed placement algorithm;pan;Proceedings of ICCAD,0

2. A Review on Bilevel Optimization: From Classical to Evolutionary Approaches and Applications

3. Improved algorithms for hypergraph bipartitioning;caldwell;Proceedings of the 2000 Asia and South Pacific Design Automation Conference,0

4. A linear-time heuristic for improving network partitions;fiduccia;Proceedings of DAC,0

5. TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs

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