Analysis of non-uniform temperature-dependent interconnect performance in high performance ICs-Reference-Cited by-同舟云学术

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Analysis of non-uniform temperature-dependent interconnect performance in high performance ICs

Published:2001 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 38th conference on Design automation - DAC '01
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Author:

Ajami Amir H.,Banerjee Kaustav,Pedram Massoud,van Ginneken Lukas P. P. P.

Publisher

ACM Press

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid Networks;Journal of Computer Science and Technology;2021-09-30

2. Domination mappings into the hamming ball: Existence, constructions, and algorithms;Advances in Mathematics of Communications;2021

3. Temperature Effect Analysis on Microstrip Structure;Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution;2019-11-22

4. A 0.003-mm2, 0.35-V, 82-pJ/conversion ultra-low power CMOS all digital temperature sensor for on-die thermal management;Analog Integrated Circuits and Signal Processing;2012-12-04

5. Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs;IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences;2011

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