SAINT-Reference-Cited by-同舟云学术

SAINT

Published:2016-11-07 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 35th International Conference on Computer-Aided Design
language:
Short-container-title:

Author:

Lin Jai-Ming¹,Chiu Po-Yang¹,Chang Yen-Fu²

Affiliation:

1. Kung University, Tainan, Taiwan

2. National Cheng Kung University, Tainan, Taiwan

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/2966986.2967071

Reference35 articles.

1. CELONCEL: Effective Design Technique for 3-D Monolithic Integration Targeting High Performance Integrated Circuits;Bobba S.;Proc. ASP-DAC, pages,2011

2. Floorplan sizing by linear programming approximation

3. Floorplanning for 3-D VLSI design

4. NTUplace3: An Analytical Placer for Large-Scale Mixed-Size Designs With Preplaced Blocks and Density Constraints

5. Multi-layer floorplanning for stacked ICs: Configuration number and fixed-outline constraints

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3. Handling Orientation and Aspect Ratio of Modules in Electrostatics-Based Large Scale Fixed-Outline Floorplanning;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

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5. A fast thermal-aware fixed-outline floorplanning methodology based on analytical models;Proceedings of the International Conference on Computer-Aided Design;2018-11-05