Interconnect-aware device targeting from PPA perspective-Reference-Cited by-同舟云学术

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Interconnect-aware device targeting from PPA perspective

Published:2016-11-07 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 35th International Conference on Computer-Aided Design
language:
Short-container-title:

Author:

Badaroglu Mustafa¹,Xu Jeff²

Affiliation:

1. Qualcomm Europe, Inc., Belgium

2. Qualcomm Technologies, Inc.

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/2966986.2980068

Reference11 articles.

1. Online: https://en.wikipedia.org/wiki/Qualcomm_Snapdragon Online: https://en.wikipedia.org/wiki/Qualcomm_Snapdragon

2. Design enablement: the challenge of being early, accurate, and complete;Mason M.E.;VLSI,2012

3. Scaling with Design Constraints: Predicting the Future of Big Chips

4. Holistic technology optimization and key enablers for 7nm mobile SoC;Song S.C.;VLSI,2015

5. Online: http://www.itrs2.net Online: http://www.itrs2.net

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Power, performance, and area evaluation across 180nm-28nm technology nodes based on benchmark circuits;IEICE Electronics Express;2024-05-10

2. Beyond Si-Based CMOS Devices: Needs, Opportunities, and Challenges;Springer Tracts in Electrical and Electronics Engineering;2024

3. More Moore;2021 IEEE International Roadmap for Devices and Systems Outbriefs;2021-11

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