Affiliation:
1. University of Electronic Science and Technology of China, Sichuan, China
Abstract
Heat dissipation and the related thermal-mechanical stress problems are the major obstacles in the development of the three-dimensional integrated circuit (3D IC). Reliability management techniques can be used to alleviate such problems and enhance the reliability of 3D IC. However, it is difficult to obtain the time-varying stress information at runtime, which limits the effectiveness of the reliability management. In this article, we propose a fast stress estimation method for runtime reliability management using artificial neural network (ANN). The new method builds ANN-based stress model by training offline using temperature and stress data. The ANN stress model is then used to estimate the important stress information, such as the maximum stress around each TSV, for reliability management at runtime. Since there are a variety of potential ANN structures to choose from for the ANN stress model, we analyze and test three ANN-based stress models with three major types of ANNs in this work: the normal ANN-based stress model, the ANN stress model with hand-crafted feature extraction, and the convolutional neural network–(CNN) based stress model. The structures of each ANN stress model and the functions of these structures in 3D IC stress estimation are demonstrated and explained. The new runtime stress estimation method is tested using the three ANN stress models with different layer configurations. Experiments show that the new method is able to estimate important stress information at extremely fast speed with good accuracy for runtime 3D IC reliability enhancement. Although all three ANN stress models show acceptable capabilities in runtime stress estimation, the CNN-based stress model achieves the best performance considering both stress estimation accuracy and computing overhead. Comparison with traditional method reveals that the new ANN-based stress estimation method is much more accurate with a slightly larger but still very small computing overhead.
Funder
National Natural Science Foundation of China
Publisher
Association for Computing Machinery (ACM)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications
Reference42 articles.
1. Impact of Mechanical Stress on the Full Chip Timing for Through-Silicon-Via-based 3-D ICs
2. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
3. Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits
4. Tianqi Chen Mu Li Yutian Li Min Lin Naiyan Wang Minjie Wang Tianjun Xiao Bing Xu Chiyuan Zhang and Zheng Zhang. [n.d.]. Mxnet: A flexible and efficient machine learning library for heterogeneous distributed systems. CoRR abs/1512.01274. Retrieved from http://arxiv.org/abs/1512.01274 Tianqi Chen Mu Li Yutian Li Min Lin Naiyan Wang Minjie Wang Tianjun Xiao Bing Xu Chiyuan Zhang and Zheng Zhang. [n.d.]. Mxnet: A flexible and efficient machine learning library for heterogeneous distributed systems. CoRR abs/1512.01274. Retrieved from http://arxiv.org/abs/1512.01274
5. Numerical Simulation of Casting Thermal Stress and Deformation Based on Finite Difference Method
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献