Author:
Budiman A.S.,Shin H.-A.-S.,Kim B.-J.,Hwang S.-H.,Son H.-Y.,Suh M.-S.,Chung Q.-H.,Byun K.-Y.,Tamura N.,Kunz M.,Joo Y.-C.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Savastiouk S. Sematech 3D ICs Workshop. San Diego, CA; September 2008.
2. Garrou P. Researchers Strive for Copper TSV Reliability. Semiconductor International; December 2009.
3. Uniaxial-process-induced strained-Si: extending the CMOS roadmap
Cited by
114 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献