Author:
Lee Young-Joon,Goel Rohan,Lim Sung Kyu
Cited by
12 articles.
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1. CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. An efficient channel clustering and flow rate allocation algorithm for non-uniform microfluidic cooling of 3D integrated circuits;Integration;2013-01
3. Conclusions and Future Directions;SpringerBriefs in Electrical and Computer Engineering;2012-08-27
4. TSVs for Power Delivery;SpringerBriefs in Electrical and Computer Engineering;2012-08-27
5. Background;SpringerBriefs in Electrical and Computer Engineering;2012-08-27