CoMETC

Author:

Ayoub Raid1,Nath Rajib2,Rosing Tajana Simunic2

Affiliation:

1. Intel Corporation

2. University of California, San Diego, CA

Abstract

We introduce a Coordinated Management of Energy, Thermal, and Cooling (CoMETC) technique to minimize cooling and memory energy of server machines. State-of-the-art solutions decouple the optimization of cooling energy costs and energy consumption of CPU and memory subsystems. This results in suboptimal solutions due to thermal dependencies between CPU and memory and the nonlinearity in energy costs of cooling. In contrast, we develop a unified solution that integrates energy, thermal, and cooling management for CPU and memory subsystems to maximize energy savings. CoMETC reduces the operational energy of the memory by clustering active memory pages to a subset of memory modules while accounting for thermal and cooling aspects. At the same time, CoMETC removes hotspots between and within the CPU sockets and reduces the effects of thermal coupling with memory in order to minimize cooling energy costs. We design CoMETC using a control-theoretic approach to guarantee meeting these objectives. We introduce a formal thermal and cooling model to be used for online decisions inside CoMETC. Our experimental results show that CoMETC achieves average cooling and memory energy savings of 58% compared to state-of-the-art techniques at a performance overhead of less than 0.3%.

Funder

UC Micro

National Science Foundation

MuSyC

CNS

Oracle

Google

Microsoft

Cisco Systems

Publisher

Association for Computing Machinery (ACM)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Experimental and optimization research of the rack thermal environment based on the dynamic server power;Journal of Building Engineering;2024-11

2. NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching;ACM Transactions on Design Automation of Electronic Systems;2023-12-18

3. Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure;ACM Transactions on Embedded Computing Systems;2023-11-09

4. Education Abstract: Thermal Challenges and Mitigation in 3D DRAM;Proceedings of the 2023 International Conference on Hardware/Software Codesign and System Synthesis;2023-09-17

5. NeuroMap: Efficient Task Mapping of Deep Neural Networks for Dynamic Thermal Management in High-Bandwidth Memory;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022-11

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3