Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects

Published:2005-06 Issue:6 Volume:24 Page:849-861
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Ajami A.H.,Banerjee K.,Pedram M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx5/43/30893/01432876.pdf?arnumber=1432876

Cited by 114 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Image Processing-Based Method of Evaluation of Stress from Grain Structures of Through Silicon Via (TSV);International Journal of Image and Graphics;2023-07-22

2. Effect of thermal incorporation in IR - Drop analysis of multilayered network and its reduction technique;2022 IEEE International Students' Conference on Electrical, Electronics and Computer Science (SCEECS);2022-02-19

3. Developing TEI-Aware Ultralow-Power SoC Platforms for IoT End Nodes;IEEE Internet of Things Journal;2021-03-15

4. Dispersion in Placement: Quantification and Insights;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021

5. Quantum Transport in a Silicon Nanowire FET Transistor: Hot Electrons and Local Power Dissipation;Materials;2020-07-26

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP