Education Abstract: Thermal Challenges and Mitigation in 3D DRAM-Reference-Cited by-同舟云学术

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Education Abstract: Thermal Challenges and Mitigation in 3D DRAM

Published:2023-09-17 Issue: Volume: Page:40-41
ISSN:
Container-title:Proceedings of the 2023 International Conference on Hardware/Software Codesign and System Synthesis
language:
Short-container-title:

Author:

Panda Preeti Ranjan¹^ORCID,Pandey Shailja²^ORCID

Affiliation:

1. Indian Institute of Technology Delhi, New Delhi, Delhi, India

2. Indian Institute of Technology Delhi, Delhi, Delhi, India

Funder

Semiconductor Research Corporation

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3607888.3610231

Reference6 articles.

1. CoMETC

2. JEDEC. JEDEC Standard High Bandwidth Memory DRAM (HBM3), JESD238. 2022.

3. S. Pandey and P. R. Panda. "NeuroMap: Efficient Task Mapping of Deep Neural Networks for Dynamic Thermal Management in High-Bandwidth Memory". In: IEEE TCAD (2022).

4. L. Siddhu, R. Kedia, and P. R. Panda. "Leakage-aware dynamic thermal management of 3D memories". In: ACM TODAES (2020).

5. PredictNcool

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