Transient Characteristic Analysis of IGBT Voltage Breakdown Failure
Author:
Affiliation:
1. Mechanical and Electrical Engineering, Wuhan Donghu University, Wuhan, China
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3443467.3443867
Reference8 articles.
1. High Power Density IGBT Module for High Reliability Application[C];Chamund D J;Proceeding of IPEMC
2. Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling
3. IGBT RBSOA non-destructive testing methods: Analysis and discussion
4. Experimental Optimisation of High Power IGBT Modules Performances Working at the Edges of their Safe Operating Area[C];Abbate C;Proceedings of PESC
5. Design for reliability of power electronics modules
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