Fast Thermal Simulation using SystemC-AMS

Author:

Chen Yukai1,Vinco Sara1,Macii Enrico1,Poncino Massimo1

Affiliation:

1. Politecnico di Torino, Torino, Italy

Funder

European Commission

Publisher

ACM

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Modeling and Real-Time Simulation of Microgrid Components Using Systemc-Ams;2023 Winter Simulation Conference (WSC);2023-12-10

2. Thermal Digital Twin of a Multi-Domain System for Discovering Mechanical Faulty Behaviors;2023 IEEE 21st International Conference on Industrial Informatics (INDIN);2023-07-18

3. SystemC-AMS Thermal Modeling for the Co-simulation of Functional and Extra-Functional Properties;ACM Transactions on Design Automation of Electronic Systems;2019-01-31

4. A SystemC-AMS Framework for the Design and Simulation of Energy Management in Electric Vehicles;IEEE Access;2019

5. A Layered Methodology for the Simulation of Extra-Functional Properties in Smart Systems;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2017-10

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