Multilevel Simulation of Nonfunctional Properties by Piecewise Evaluation

Author:

Hatami Nadereh1,Baranowski Rafal1,Prinetto Paolo2,Wunderlich Hans-Joachim1

Affiliation:

1. University of Stuttgart, Stuttgart, Germany

2. Politecnico di Torino, Torino TO, Italy

Abstract

As the technology shrinks, nonfunctional properties (NFPs) such as reliability, vulnerability, power consumption, or heat dissipation become as important as system functionality. As NFPs often influence each other, depend on the application and workload of a system, and exhibit nonlinear behavior, NFP simulation over long periods of system operation is computationally expensive, if feasible at all. This article presents a piecewise evaluation method for efficient NFP simulation. Simulation time is divided into intervals called evaluation windows , within which the NFP models are partially linearized. High-speed functional system simulation is achieved by parallel execution of models at different levels of abstraction. A trade-off between simulation speed and accuracy is met by adjusting the size of the evaluation window. As an example, the piecewise evaluation technique is applied to analyze aging caused by two mechanisms, namely Negative Bias Temperature Instability (NBTI) and Hot Carrier Injection (HCI), in order to identify reliability hotspots. Experiments show that the proposed technique yields considerable simulation speedup at a marginal loss of accuracy.

Funder

Deutsche Forschungsgemeinschaft

Publisher

Association for Computing Machinery (ACM)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. SystemC-AMS Thermal Modeling for the Co-simulation of Functional and Extra-Functional Properties;ACM Transactions on Design Automation of Electronic Systems;2019-01-31

2. Multi-level timing and fault simulation on GPUs;Integration;2019-01

3. Fast Thermal Simulation using SystemC-AMS;Proceedings of the 26th edition on Great Lakes Symposium on VLSI;2016-05-18

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