On thermal effects in deep sub-micron VLSI interconnects-Reference-Cited by-同舟云学术

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On thermal effects in deep sub-micron VLSI interconnects

Published:1999 Issue: Volume: Page:
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Container-title:Proceedings of the 36th ACM/IEEE conference on Design automation conference - DAC '99
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Author:

Banerjee Kaustav,Mehrotra Amit,Sangiovanni-Vincentelli Alberto,Hu Chenming

Publisher

ACM Press

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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