Design for reliability: Tradeoffs between lifetime and performance due to electromigration-Reference-Cited by-同舟云学术

Design for reliability: Tradeoffs between lifetime and performance due to electromigration

Published:2021-02 Issue: Volume:117 Page:114025
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wolff Francis,Weyer Daniel,Papachristou Chris,Clay Steve

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference69 articles.

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4. B. Baily, “Aging problems at 5nm and below,” Semiconductor Engineering, June 11, 2020. [Online]. Available: semiengineering.com.

5. B. Baily, “Chip aging becomes design problem,” Semiconductor Engineering, August 9, 2018. [Online]. Available: semiengineering.com.

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