Author:
Huang Shi-Yu,Lin Yu-Hsiang,Tsai Kun-Han (Hans),Cheng Wu-Tung,Sunter Stephen,Chou Yung-Fa,Kwai Ding-Ming
Cited by
8 articles.
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1. A Cost-Effective Built-In Self-Test Mechanism for Post-Manufacturing TSV Defects in 3D ICs;ACM Journal on Emerging Technologies in Computing Systems;2022-10-13
2. Increasing the Fault Coverage of a Truncated Test Set;ACM Transactions on Design Automation of Electronic Systems;2022-06-27
3. Covering Test Holes of Functional Broadside Tests;ACM Transactions on Design Automation of Electronic Systems;2021-05-31
4. Equivalent Faults under Launch-on-Shift (LOS) Tests with Equal Primary Input Vectors;ACM Transactions on Design Automation of Electronic Systems;2021-04
5. Target Faults for Test Compaction Based on Multicycle Tests;ACM Transactions on Design Automation of Electronic Systems;2020-03-17