3DIC benefit estimation and implementation guidance from 2DIC implementation
Author:
Affiliation:
1. ECE
2. University of California at San Diego
3. ECE and University of California at San Diego
4. Qualcomm Research, San Diego, CA
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/2744769.2747954
Reference24 articles.
1. OCV-aware top-level clock tree optimization
2. 3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS;Batude P.;IEEE JETCAS,2012
3. Thermal Design Space Exploration of 3D Die Stacked Multi-core Processors Using Geospatial-Based Predictive Models
4. Rethinking the Wirelength Benefit of 3-D Integration
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