Monolithic 3D Integration: A Path from Concept to Reality-Reference-Cited by-同舟云学术

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Monolithic 3D Integration: A Path from Concept to Reality

Published:2015 Issue: Volume: Page:
ISSN:
Container-title:Design, Automation & Test in Europe Conference & Exhibition (DATE), 2015
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Author:

Shulaker Max M.,Wu Tony F.,Sabry Mohamed M.,Wei Hai,Philip Wong H.-S.,Mitra Subhasish

Publisher

IEEE Conference Publications

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comprehensive Modeling of Switching Behavior in BEOL FeFET for Monolithic 3-D Integration;IEEE Transactions on Electron Devices;2024-01

2. A Near-Memory Dynamically Programmable Many-Core Overlay;2023 IEEE 16th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC);2023-12-18

3. BEOL FeFET SPICE-Compatible Model for Benchmarking 3-D Monolithic In-Memory TCAM Computation;IEEE Transactions on Electron Devices;2023-12

4. All-2D electronics for AI processing;Nature Materials;2023-11-27

5. Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions;Nature Materials;2023-11-27

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