Cost/Performance Single-Chip Module-Reference-Cited by-同舟云学术

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Cost/Performance Single-Chip Module

Published:1982-05 Issue:3 Volume:26 Page:278-285
ISSN:0018-8646
Container-title:IBM Journal of Research and Development
language:
Short-container-title:IBM J. Res. & Dev.

Author:

Bendz D. J.,Gedney R. W.,Rasile J.

Publisher

IBM

Subject

General Computer Science

Link

http://xplorestaging.ieee.org/ielx5/5288520/5390503/05390505.pdf?arnumber=5390505

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ceramic Chip Carriers;Area Array Interconnection Handbook;2001

2. History of Flip Chip and Area Array Technology;Area Array Interconnection Handbook;2001

3. Soft X-ray fluorescence measurements of polyimide films;Thin Solid Films;1999-12

4. Evolution of engineering change and repair technology in high performance multichip modules at IBM;IEEE Transactions on Advanced Packaging;1999-05

5. Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics;Journal of Materials Science Materials in Electronics;1997

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