1. The National Technology Roadmap for Semiconductors, 1997 Edition, Semiconductor Industry Association.
2. Microelectronics Packaging Handbook, R. R. Tummala and E. Rymaszewski, eds., New York, Van Nostrand Rienhold, 1989.
3. A. J. Blodgett “Microelectronic Packaging,” Sci. Amer., 249, p. 86, 1983.
4. Multichip Modules Technology Handbook, P.E. Garrou and I. Turlik, eds., New York, McGraw-Hill, 1998.
5. Proc. ISHM;K Yokouchi,1991