Surface analysis and characterization of large printed-circuit-board circuitization process steps
Author:
Publisher
IBM
Subject
General Computer Science
Link
http://xplorestaging.ieee.org/ielx5/5288520/5389970/05389981.pdf?arnumber=5389981
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Low-frequency ‘delay time’ ultrasound and its effect on electroless Cu metallisation of a Pd activated dielectric material;Thin Solid Films;2015-12
2. Open trace defects in FR4 printed circuit boards;Circuit World;2006-01-01
3. Fine line circuit manufacturing technology with electroless copper plating;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A;1995-03
4. Characterisation of a PdCl2/SnCl2 electroless plating catalyst system adsorbed on barium titanate-based electroactive ceramics;Applied Surface Science;1994-03
5. Electrochemical deposition of novel materials and structures;Solar Energy Materials and Solar Cells;1992-09
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