Open trace defects in FR4 printed circuit boards-Reference-Cited by-同舟云学术

Open trace defects in FR4 printed circuit boards

Published:2006-01-01 Issue:1 Volume:32 Page:3-7
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:

Author:

Ganesan Sanka,Pecht Michael

Abstract

PurposeTo present and discuss open trace defects uncovered in an FR4 assembly during electrical testing.Design/methodology/approachThis paper presents open trace defects observed in FR4 assemblies and analyses the distribution of defects. The paper also discusses possible root causes for their occurrence.FindingsThe open trace defects that occurred during printed circuit board (PCB) fabrication should have been observed by the board manufacturer. It appears that the PCB manufacturer did not perform automatic optical inspection (AOI) and electrical testing during the manufacturing of the boards. The cost due to the rejected PCBAs was approximately 3x times that of the PCB cost.Originality/valueThe paper highlights the costly impact of uncovering a PCB defect after assembly. Based on the results of this study, the implementation of electrical testing and AOI for PCBs is recommended.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference10 articles.

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3. Barbetta, M. (1998), “Interconnect defects”, Printed Circuit Fabrication, Vol. 21 No. 1, pp. 24‐6.

4. Cohen, R. (1995), “Between the lines a look at technology for fine‐line inspection”, Printed Circuit Fabrication, Vol. 18 No. 7, pp. 40‐2.

5. Hastie, W.M. (1986), “AOIS have it – practical automatic inspection of bare boards”, Circuit Manufacturing, Vol. 26 No. 1, pp. 22‐4.

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