Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules
Author:
Affiliation:
1. Department of Electrical & Electronic EngineeringUniversity of Nottingham, University Park Nottingham UK
2. Dynex Semiconductor Ltd Doddington Road Lincoln UK
Funder
Engineering and Physical Sciences Research Council
Mentor Graphics
Publisher
Wiley
Subject
Histology,Pathology and Forensic Medicine
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1111/jmi.12803
Reference37 articles.
1. Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K
2. Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator
3. A thermal cycling reliability study of ultrasonically bonded copper wires
4. Fracture Appearance and Mechanisms of Deformation and Fracture
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