Mud-Cracking Effect of Sintered Silver Layer on Quantifying Heat Transfer Behavior of SiC Devices Under Power Cycling: Voronoi Tessellation Model-Reference-Cited by-同舟云学术

Mud-Cracking Effect of Sintered Silver Layer on Quantifying Heat Transfer Behavior of SiC Devices Under Power Cycling: Voronoi Tessellation Model

Published:2022-06 Issue:6 Volume:12 Page:964-972
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Qin Fei¹^ORCID,Zhao Shuai²^ORCID,Dai Yanwei¹^ORCID,Hu Yuankun¹,An Tong¹^ORCID,Gong Yanpeng¹

Affiliation:

1. Beijing Key Laboratory of Advanced Manufacturing Technology and the Faculty of Materials and Manufacturing, Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China

2. Faculty of Materials and Manufacturing, Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China

Funder

National Natural Science Foundation of China

Beijing Municipal Natural Science Foundation

Scientific Research Common Program of Beijing Municipal Commission of Education

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9805411/09782405.pdf?arnumber=9782405

Reference25 articles.

1. Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling

2. Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules

3. Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

4. Poperties of bulk sintered silver as a function of porosity;wereszczak,2012

5. Thermal conductivity estimation of inkjet-printed silver nanoparticle ink during continuous wave laser sintering;hyun;Int J Heat Mass Transf,2015

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