Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions
Author:
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1460-2695.2006.01070.x/fullpdf
Reference29 articles.
1. Mechanical characterization of Sn‐3.5Ag solder joints at various temperatures
2. Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre‐strained eutectic Sn‐3.5Ag solder joints
3. Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints
4. Effects of prestrain, rate of prestrain, and temperature on the stress-relaxation behavior of eutectic Sn-3.5Ag solder joints
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3. Evolution of microstructure and effects on crack formation of Sn3.0Ag0.5Cu/Cu solder joints under accelerated thermal cycling;Materials Research Express;2019-04-05
4. Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module;International Journal of Solids and Structures;2017-02
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