GOLD WIRE AND SOLDER JOINT MICROFORCE TESTING USING MICROFORCE TESTER-Reference-Cited by-同舟云学术

GOLD WIRE AND SOLDER JOINT MICROFORCE TESTING USING MICROFORCE TESTER

Published:2003-09 Issue:5 Volume:27 Page:37-40
ISSN:0732-8818
Container-title:Experimental Techniques
language:en
Short-container-title:Experimental Techniques

Author:

Chao Y.C.,Liu D.S.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Reference7 articles.

1. 2. A. Concoulas , Hot Work Ultrasonic Bonding-A Method of Facilitating Metal Flow by Restoration Process, 20thIEEE Electronic Component Conf., 549 -556 , 1970 .

2. 4. A.A.O. Tay, B.C. Seah, and S.H. Ong , Finite Element Simulation of Wire Looping During Wirebonding, Proceeding of Advances in Electronic Packaging, ASME, 1997 .

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