PRACTICAL EVALUATION FOR LONG-TERM STABILITY OF THERMAL INTERFACE MATERIAL-Reference-Cited by-同舟云学术

PRACTICAL EVALUATION FOR LONG-TERM STABILITY OF THERMAL INTERFACE MATERIAL

Published:2009-01 Issue:1 Volume:33 Page:28-32
ISSN:0732-8818
Container-title:Experimental Techniques
language:en
Short-container-title:

Author:

Chen C.I.,Ni C.Y.,Pan H.Y.,Chang C.M.,Liu D.S.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Reference8 articles.

1. 1. Blazej, D. , “Thermal Interface Materials,” Electronic Cooling 9(4): 14-20 (2003).

2. 2. Culham, R.J. , Teertstra, P. , Savija, I. , and Yovanovich, M.M. , “Design, Assembly and Commissioning of a Test Apparatus for Characterizing Thermal Interface Materials,” 8th Inter Society Conference on Thermal Phenomena, May 30-June 1: 128-135 (2002).

3. 3. Liu, B.M. , and Mui, Y.C ., “TIM Characterization for High Performance Microprocessors,” 7th Electronics Packaging Technology Conference 1: 532-536 (2005).

4. 4. Chiu, C.P. , Chandran, B. , Mello, M. , and Kelley, K ., “An Accelerated Reliability Test Method to Predict Thermal Grease Pump-Out in Flip-Chip Applications,” 51st Electronic Components and Technology Conference, May 29-June 1: 91-97 (2001).

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