Author:
Lin Wei,Wong C. P. (Ching-Ping)
Publisher
Springer International Publishing
Reference314 articles.
1. Moore, G.E.: Progress in digital integrated electronics. In: International Electron Devices Meetings, pp. 11–13 (1975)
2. Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhogl, W., von Glasow, A., Mosig, K., Bertagnolli, E.: Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes. Microelectron. Eng. 64, 409–416 (2002)
3. Kreupl, F., Graham, A.P., Duesberg, G.S., Steinhogl, W., Liebau, M., Unger, E., Honlein, W.: Carbon nanotubes in interconnect applications. Microelectron. Eng. 64, 399–408 (2002)
4. Li, J., Ye, Q., Cassell, A., Ng, H.T., Stevens, R., Han, J., Meyyappan, M.: Bottom-up approach for carbon nanotube interconnects. Appl. Phys. Lett. 82, 2491–2493 (2003)
5. Nihei, M., Horibe, M., Kawabata, A., Awano, Y.: Simultaneous formation of multiwall carbon nanotubes and their end-bonded ohmic contacts to Ti electrodes for future ULSI interconnects. Jpn. J. Appl. Phys. Part 1 Regul. Pap. Short Notes Rev. Pap. 43, 1856–1859 (2004)