Bottom-up approach for carbon nanotube interconnects
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1566791
Reference17 articles.
1. Electromigration Performance of Multi-level Damascene Copper Interconnects
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3. Fabrication and Performance Limits of Sub-0.1 µm Cu Interconnects
4. Simulations and experiments of etching of silicon in HBr plasmas for high aspect ratio features
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