Measurement of Stress Due to Thermal Expansion Anisotropy in Al2O3
Author:
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1982.tb10390.x/fullpdf
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1. Thermal microstresses in beryllium and other HCP materials
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4. Grain Size/Microcracking Relations for Pseudobrookite Oxides
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