Thermal microstresses in beryllium and other HCP materials-Reference-Cited by-同舟云学术

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Thermal microstresses in beryllium and other HCP materials

Published:1971-11 Issue:11 Volume:2 Page:3073-3077
ISSN:1073-5615
Container-title:Metallurgical and Materials Transactions B
language:en
Short-container-title:Metall and Materi Trans B

Author:

Armstrong R. W.,Borch N. R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02814957.pdf

Reference22 articles.

1. G. A. Malygin and V. A. Likhachev:Zavod. Lab., 1966, vol. 32, p. 335.

2. A. A. Denton:Met. Rev., 1966, vol. 11, p. 1.

3. W. J. McG. Tegart:J. Inst. Met., 1962, vol. 91, p. 99.

4. F. J. P. Clarke:Acta Met., 1964, vol. 12, p. 139.

5. W. Boas and R. W. K. Honeycombe:Proc. Roy. Soc. (London), 1946, vol. A186, p. 57.

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling brittle fracture due to anisotropic thermal expansion in polycrystalline materials;Computational Materials Science;2021-06

2. A neutron diffraction and modeling study of uniaxial deformation in polycrystalline beryllium;Metallurgical and Materials Transactions A;2003-07

3. Thermoelastic Micromechanical Stresses Associated with a Large alpha-Silicon Carbide Grain in a Polycrystalline beta-Silicon Carbide Matrix;Journal of the American Ceramic Society;1989-03

4. PHASE TRANSFORMATION TRIGGERED BY EXTERNAL LOADING IN POLYCRYSTALLINE Cr-DOPED V2O3;Le Journal de Physique Colloques;1982-12

5. Measurement of Stress Due to Thermal Expansion Anisotropy in Al2O3;Journal of the American Ceramic Society;1982-03

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