Effect of sugar replacement with stevianna and inulin on the texture and predictive glycaemic response of muffins
Author:
Affiliation:
1. Department of Wine, Food and Molecular Biosciences Lincoln University Lincoln 7608 Canterbury New Zealand
Publisher
Wiley
Subject
Industrial and Manufacturing Engineering,Food Science
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1111/ijfs.13143
Reference49 articles.
1. Quality of Reduced-Fat Chiffon Cakes Prepared with Erythritol-Sucralose as Replacement for Sugar
2. Impact of Using Stevia on Physicochemical, Sensory, Rheology and Glycemic Index of Soft Ice Cream
3. Effects of stevia, aspartame, and sucrose on food intake, satiety, and postprandial glucose and insulin levels
4. Effect of inulin soluble dietary fibre addition on technological, sensory, and structural properties of durum wheat spaghetti
Cited by 90 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Deciphering the effect of Chlorella minutissima incorporation in gluten-free millet cookies: Physical and functional properties;Algal Research;2024-08
2. The Effect of Inulin Substitution as A Fat Replacer on Physicochemical and Sensory Properties of Muffins;Pertanika Journal of Tropical Agricultural Science;2024-05-30
3. Quality characteristics of cereal-based foods enriched with different degree of polymerization inulin: A review;Carbohydrate Polymers;2024-05
4. Low-sugar egg-based dessert (sweet egg yolk drops): Characterization, consumer acceptance and driver of liking;Heliyon;2023-11
5. DEVELOPMENT AND EVALUATION OF FREE SUGAR JELLY MADE WITH LEAFY VEGETABLES AS A FUNCTIONAL FOOD;Carpathian Journal of Food Science and Technology;2023-10-30
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3