A Method of Fabricating Electroplated Structures using Side-wall Electrical Contact-Reference-Cited by-同舟云学术

A Method of Fabricating Electroplated Structures using Side-wall Electrical Contact

Published:2014 Issue:2 Volume:134 Page:20-25
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Aono Takanori¹,Yoshimura Yasuhiro¹,Nakayama Yoshinori²,Kanamaru Masatoshi¹

Affiliation:

1. Hitachi, Ltd., Hitachi Research Laboratory

2. Hitachi, Ltd., Central Research Laboratory

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/ieejsmas/134/2/134_20/_pdf

Reference9 articles.

1. (1) H. Guckel : “High-Aspect-Ratio Micromachining Via Deep X-Ray Lithography”, Proc. IEEE, Vol. 86, No. 8, pp. 1586-1593 (1998)

2. (2) G. Engelmann, O. Ehrmann, J. Simon, and H. Reichl : “Fabrication of High Depth-to-Width Aspect Ratio Microstructure”, Micro Electro Mechancal Systems '92, pp. 93-98 (1992)

3. (3) J. Gobet, F. Cardot, J. Bergqvist, and F. Rudolf : “Electrodeposition of 3D microstructures on Silicon”, J. Micromech. Microeng., 3, pp. 123-130 (1993)

4. (4) B.-H. Kim, B.-J. Park, B.-H. Kum, and J.-B. Kim : A MEMS Probe Card with High Aspect Ratio Electroplated Posts, Microprocesses and Nanotechnology, pp. 482-483 (2007)

5. (5) J. Voldman, M. Toner, M. L. Gray, and M. A. Schmidt : “A Dielectrophoresis-based Array Cytometer”, TRANSDUCERS'01 & EUROSENSORS XV, pp. 322-325 (2001)

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