Boron-Implanted Termination Structures for Vertical GaN Power Devices with Highly Enhanced Breakdown Voltage
Author:
Affiliation:
1. AIST Advanced Power Electronics Research Center
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Link
https://www.jstage.jst.go.jp/article/ieejeiss/144/3/144_251/_pdf
Reference11 articles.
1. (1) J. Baliga : “Fundamentals of Power Semiconductor Devices”, Springer, pp. 149-155 (2008)
2. (2) D. C. Sheridan, G. Niu, and J. D. Cressler : “Design of single and multiple zone junction termination extension structures for SiC power devices”, Solid-State Electron., Vol. 45, pp. 1659-1664 (2001)
3. (3) W. Sung, E. V. Brunt, B. J. Baliga, and A. Q. Huang : “A new edge termination technique for high-voltage devices in 4H-SiC multiple-floating-zone junction termination extension”, IEEE Electron Device Lett., Vol. 32, pp. 880-882 (2011)
4. (4) J. R. Dickerson, A. A. Allerman, B. N. Bryant, A. J. Fischer, M. P. King, M. W. Moseley, A. M. Armstrong, R. J. Kaplar, I.C. Kizilyalli, O. Aktas, and J. J. Wierer : “Vertical GaN power diodes with a bilayer edge termination”, IEEE Trans. Eletron. Devices, Vol. 63, No. 1, pp. 419-425 (2016)
5. (5) J. Wang, L. Cao, J. Xie, E. Beam, R. McCarthy, C. Youtsey, and P. Fay : “High voltage, high current, GaN-on-GaN p-n diodes with partially compensated edge termination”, Appl. Phys. Lett., p. 023502 (2018)
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