Multiwavelength shearing interferometry for measuring the slopes, curvatures, and shapes of thin films/substrate systems-Reference-Cited by-同舟云学术

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Multiwavelength shearing interferometry for measuring the slopes, curvatures, and shapes of thin films/substrate systems

Published:2013-12-13 Issue:24 Volume:38 Page:5446
ISSN:0146-9592
Container-title:Optics Letters
language:en
Short-container-title:Opt. Lett.

Author:

Zhang Changxing,Dong Xuelin,Feng Xue,Hwang Keh-Chih

Funder

Natural Science Foundation of China

Tsinghua University Initiative Scientific Research Program

Publisher

The Optical Society

Subject

Atomic and Molecular Physics, and Optics

Reference19 articles.

1. Substrate curvature due to thin film mismatch strain in the nonlinear deformation range

2. The effect of thin film/substrate radii on the Stoney formula for thin film/substrate subjected to nonuniform axisymmetric misfit strain and temperature

3. Effects of line and passivation geometry on curvature evolution during processing and thermal cycling in copper interconnect lines

4. Stresses in a Multilayer Thin Film/Substrate System Subjected to Nonuniform Temperature

5. Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. Part II: Experimental validation of the non-local stress/curvature relations

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1. A self-referenced interferometer for in situ cryogenic wafer curvature measurements;Review of Scientific Instruments;2024-04-01

2. Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures;Surfaces;2021-03-19

3. Multi-frequency lateral shear interferometer system for simultaneous measurement of thickness and three-dimensional shape;Chinese Optics Letters;2018

4. Double transmission-mediums based geometric phase analysis for determining the two surface profiles of transparent object;Optics and Lasers in Engineering;2016-05

5. Digital Gradient Sensing Method to Evaluate Thermal Stress at Elevated Temperatures;Experimental Mechanics;2016-03-23

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