Affiliation:
1. University of Shanghai for Science and Technology
2. Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences
3. ShanghaiTech University
Abstract
Herein, X-ray photoelectron spectrometer (XPS), angle-resolved XPS (ARXPS), and atomic force microscopy (AFM) are used to study the surface changes of Ta2O5 bombarded by Ar+ ions with different energies. The results reveal that the Ar+ bombardment of Ta2O5 leads to a preferential sputtering of O atoms, which results in an imbalance in the Ta/O ratio on the material surface; and the formation of an “altered layer” composed of Ta2O5, Ta1+, Ta2+, Ta3+, and Ta4+. The Ta/O ratio increases from 0.34 to 0.55 with the sputtering time; however, it does not vary with ion energy. Before reaching a steady-state, the thickness of the altered layer increases with the sputtering time; however, after reaching a steady-state, the thickness of the altered layer does not exceed 3 nm. Concurrently, it increases with increasing sputtering energy. Further, AFM measurements reveal that low-energy Ar+ bombardment leads to a slight increased surface roughness, which does not exceed the initial value (0.41 nm) by 25%.
Funder
Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences
Subject
Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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