Author:
Chang Shih-Yang,Chu Yi-Cheng,Tu K.N.,Chen Chih
Funder
Ministry of Science and Technology, Taiwan
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference26 articles.
1. Vertical interconnects of microbumps in 3D integration;Chen;MRS Bull.,2015
2. A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps;Chang;Sci. Rep.,2018
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4. Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps;Shen;Mater. Lett.,2019
5. Study on Ar (5% H2) plasma pretreatment for Cu/Sn/Cu solid-state-diffusion bonding in 3D interconnection;Wang,2016
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