Elevated-temperature shear strength and hardness of Zn–3Cu–xAl ultra-high-temperature lead-free solders
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Isothermal aging characteristics of Sn–Pb micro solder bumps
2. Shear strength of the Zn–Sn high-temperature lead-free solders
3. Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders
4. Alloy design of Zn–Al–Cu solder for ultra high temperatures
5. Creep kinetics in compression of sand cast commercial Zn–Al alloys
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