Processing and mechanical behavior of Cu-Bi alloys with high volume fraction of Bi: Suitability for high temperature soldering application-Reference-Cited by-同舟云学术

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Processing and mechanical behavior of Cu-Bi alloys with high volume fraction of Bi: Suitability for high temperature soldering application

Published:2016-06 Issue: Volume:666 Page:339-349
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Barman Binay Kumar Deb,Singh Shobhit Pratap,Kumar Praveen

Funder

Board of Research in Nuclear Sciences

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference46 articles.

1. High-temperature lead-free solders: properties and possibilities;Suganuma;JOM,2009

2. K.N. Subramanian, “Lead-free Solders: Materials Reliability for Electronics”, ed. K.N. Subramanian, Wiley, 2012.

3. Are you ready for lead-free electronics?;Eveloy;IEEE Trans. Compon. Pack. Technol.,2005

4. Current problems and possible solutions in high-temperature lead-free soldering;Kroupa;J. Mater. Eng. Perform.,2012

5. The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder;Tomlinson;J. Mater. Sci.,1987

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4. The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering;Materials & Design;2020-01

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