Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference23 articles.
1. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
2. Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
3. A study on the microstructure and phase transformation of electroless nickel deposits
4. Microstructures and crystallization of electroless Ni-P deposits
5. Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints
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1. The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates;Journal of Materials Research and Technology;2023-11
2. Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders;Applied Surface Science;2023-07
3. The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior;Surface and Coatings Technology;2023-03
4. Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish;Materials;2023-02-20
5. Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes;Journal of Materials Science: Materials in Electronics;2023-01
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