Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference23 articles.
1. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
2. Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
3. A study on the microstructure and phase transformation of electroless nickel deposits
4. Microstructures and crystallization of electroless Ni-P deposits
5. Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints
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1. Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances;Materials Today Communications;2024-06
2. Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni);Journal of Materials Science: Materials in Electronics;2024-04
3. The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates;Journal of Materials Research and Technology;2023-11
4. Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders;Applied Surface Science;2023-07
5. The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior;Surface and Coatings Technology;2023-03
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