In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis-Reference-Cited by-同舟云学术

In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis

Published:2021-01 Issue: Volume:802 Page:140584
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Zhou Quan,Lee Tae-Kyu,Bieler Thomas R.

Funder

U.S. Department of Energy

National Science Foundation

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference42 articles.

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4. Determination of the elastic moduli of tin single crystals, and their variation with temperature;House;Br. J. Appl. Phys.,1960

5. Reliability of lead-free interconnections under consecutive thermal and mechanical loadings;Mattila;J. Electron. Mater.,2006

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