Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu-Reference-Cited by-同舟云学术

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Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu

Published:2017-12 Issue: Volume:708 Page:142-148
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Chen Chih-Hao,Chakroborty Subhendu,Lee Boon-Ho,Chen Hsiang-Chuan,Wang Chang-Meng,Wu Albert T.

Funder

Ministry of Science and Technology

SHENMAO Technology Inc

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference21 articles.

1. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

2. Large-scale complementary integrated circuits based on organic transistors;Crone;Nature,2000

3. Wafer warpage analysis of stacked wafers for 3D integration;Kim;Microelectron. Eng.,2012

4. In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation X-rays;Wu;J. Electron. Mater.,2009

5. Characterization of chip scale packaging materials;Amagai;Microelectron. Reliab.,1999

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fast fabrication of double-layer printed circuits using bismuth-based low-melting alloy beads;Journal of Materials Chemistry C;2020

2. Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates;Materials Science and Engineering: A;2019-06

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