Fast fabrication of double-layer printed circuits using bismuth-based low-melting alloy beads-Reference-Cited by-同舟云学术

Fast fabrication of double-layer printed circuits using bismuth-based low-melting alloy beads

Published:2020 Issue:24 Volume:8 Page:8028-8035
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Zhang Pengju¹²³⁴⁵^ORCID,Yu Yang⁶⁷⁵,Chen Bowei¹²³⁴⁵,Wang Wei⁸⁹¹⁰⁵,Wei Sijian¹¹¹²¹³⁷⁵^ORCID,Rao Wei¹²³⁴⁵^ORCID,Wang Qian¹²³⁴⁵^ORCID

Affiliation:

1. Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics

2. Technical Institute of Physics and Chemistry

3. Chinese Academy of Sciences

4. Beijing 100190

5. China

6. Beijing Dream Ink Technologies Co., Ltd

7. Beijing 100084

8. School of Electrical Engineering

9. Chongqing University

10. Chongqing 400044

11. Electronic Technology Lab

12. Fundamental Industry Training Center

13. Tsinghua University

Abstract

A novel fabrication method for double-layer printed circuits was reported based on BiInSn beads, offering more simplicity, practicability and functional diversity.

Funder

National Natural Science Foundation of China

Beijing Municipal Science and Technology Commission

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2020/TC/D0TC01806F

Reference51 articles.

1. All-Printed Flexible and Stretchable Electronics

2. Low-Cost Fabrication of Printed Electronics Devices through Continuous Wave Laser-Induced Forward Transfer

3. Double-sided printed circuit textiles based on stencil-type layer-by-layer coating with PEDOT:PSS:Ag nanowires and chitosan for electrothermochromic displays

4. Printable Thin Film Supercapacitors Using Single-Walled Carbon Nanotubes

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