Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference17 articles.
1. Interfacial reactions between lead-free solders and common base materials
2. Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect
3. Interfacial embrittlement by bismuth segregation in copper/tin–bismuth Pb-free solder interconnect
4. Fracture of SnBi/Ni(P) interfaces
5. Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad
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2. Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging;Soldering & Surface Mount Technology;2024-06-04
3. Fast reactive interdiffusion between solid brass and liquid aluminium;Results in Materials;2023-12
4. Effects of alloying elements on the interfacial segregation of bismuth in tin-based solders;Materials Today Communications;2023-06
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