1. Z. C. Mei, F. Hua, and J. Glazer, in Proceedings of SMTA International, Edina, MN, p. 399 (1999).
2. F. Hua, Z. Mei, and J. Glazer, in Proceedings of 48th Electronic Components and Technology Conference, New York, p. 277 (1998).
3. Getting Ready for Lead‐free Solders*
4. Y. Yamagishi, M. Ochiai, H. Ueda, T. Nakanishi, and M. Kitazima, in Proceedings of the 9th International Microelectronics Conference, Tokyo, p. 252 (1996).