Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments-Reference-Cited by-同舟云学术

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Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

Published:2014-03 Issue: Volume:597 Page:219-224
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Zhang Liang,Han Ji-guang,Guo Yong-huan,He Cheng-wen

Funder

the Natural Science Foundation of Jiangsu Province

the Natural Science Foundation of the Higher Education Institutions of Jiangsu Province

the Jiangsu Normal University Foundation

the Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

2. Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint

3. Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

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3. Investigations on deformation and fracture behaviors of the multi-alloyed SnAgCu solder and solder joint by in-situ observation;Microelectronics Reliability;2022-08

4. Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties;Materials & Design;2022-03

5. Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure;Chinese Journal of Mechanical Engineering;2021-11-27

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