Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference27 articles.
1. Influence of the addition of indium on the mechanical creep of Sn–3.5%Ag alloy
2. Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads
3. Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates
4. Pb-free solder-alloy based on Sn–Zn–Bi with the addition of germanium
5. High temperature synthesis of Sn–3.5Ag–0.5Zn alloy nanoparticles by chemical reduction method
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