Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Lead-free Solders in Microelectronics
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag
4. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
5. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
Cited by 160 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples;Journal of the Taiwan Institute of Chemical Engineers;2024-02
2. Alteration of Cu3Sn growth and retention of multi-orientation Cu6Sn5 during thermal aging in Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bonding;Materials Characterization;2024-01
3. Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint;Journal of Materials Science: Materials in Electronics;2024-01
4. Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles;Journal of Materials Science: Materials in Electronics;2023-12
5. Grain modification and formation of tough IMC phase in submicron Sn–Ag microbumps via doping Zn and Ni in Cu substrate;Vacuum;2023-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3