Study on the effect of ceria concentration on the silicon oxide removal rate in chemical mechanical planarization
Author:
Funder
MOTIE
KSRC
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference20 articles.
1. Microelectronic Applications of Chemical Mechanical Planarization;Li,2007
2. Shallow trench isolation chemical mechanical planarization: a review;Srinivasan;ECS J. Solid State Sci. Technol.,2015
3. Slurry additive effects on the suppression of silicon nitride removal during CMP;America;Electrochem. Solid-state Lett.,2004
4. Role of different additives on silicon dioxide film removal rate during chemical mechanical polishing using ceria-based dispersions;Dandu;J. Electrochem. Soc.,2010
5. Silicon nitride film removal during chemical mechanical polishing using ceria-based dispersions;Veera Dandu;J. Electrochem. Soc.,2011
Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Evaluation of chemical mechanical polishing characteristics using mixed abrasive slurry: A study on polishing behavior and material removal mechanism;Applied Surface Science;2025-01
2. Optimization of surface filtration to enhance wafer uniformity by removing large particle in ceria slurry;Materials Science in Semiconductor Processing;2024-11
3. The effect of amino acid addition in CeO2-based slurry on SiO2/Si3N4 CMP: Removal rate selectivity, morphology, and mechanism research;Journal of Molecular Liquids;2024-10
4. Photocatalytic assisted chemical mechanical polishing for silicon carbide using developed ceria coated diamond core-shell abrasives;Tribology International;2024-09
5. A review on the development of ceria for chemical mechanical polishing;Powder Technology;2024-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3